Hon San Technology CO.,LTD.
Hon San Technology CO.,LTD.
  • HOME
  • ABOUT US
  • PRODUCTS
  • LANGUAGE
    • Traditional Chinese
  • More
    • HOME
    • ABOUT US
    • PRODUCTS
    • LANGUAGE
      • Traditional Chinese
  • HOME
  • ABOUT US
  • PRODUCTS
  • LANGUAGE
    • Traditional Chinese

MODEL NO. HS01MWCP / Liquid cold plate

The HS01MWCP cold plate features an integrated liquid pathway, it boasts a slim 12mm profile.

Description

The HS01MWCP is a liquid-cooled module designed for effective cooling of heat sources. It features dimensions of 300mm x 300mm x 12mm and an ultra-thin thickness of just 12mm, making it ideal for planar heat source cooling. With a safe liquid flow rate of 5L/min or below and a thermal resistance of 0.0011℃/W, it delivers efficient performance. Its large heat dissipation surface area of 90000mm² ensures outstanding cooling capabilities.

Technical Specifications:

  • Dimensions: 300mm x 300mm x 12mm
  • Weight: 2.05kg
  • Material: High thermal conductivity aluminum alloy for superior heat dissipation
  • Safe liquid flow rate: 5L/min or below
  • Maximum liquid pressure: 0.4kg/cm² to ensure operational safety
  • Cooling liquid inlet/outlet connectors: Compatible with 3/8″ hoses

Cooling Performance:

  • Thermal resistance (reference): Approximately 0.0011℃/W at 20°C cooling liquid temperature with a standard flow rate of 5L/min
  • Cooling effect for a 2000W heat source: Reference temperature on the heat conduction surface is approximately 24.2°C

Design Features:

  • Cooling liquid inlet/outlet connectors: Compatible with 1/2″ hoses for ease of connection
  • Heat dissipation area: Offers an extensive 90000mm² surface area, ensuring effective cooling of heat sources
  • Slim and flat design: Ideal for planar heat source cooling, maximizing versatility

Structure:

  • Heat source mounting holes: Customizable to meet client requirements for securely fixing heat sources
  • Ultra-thin design: Enables a lightweight, flat plate optimized for planar applications

CHARACTERS & FEATURES

HS01MWCP Flowrate vs. Thermal Resistance

    Copyright © 2024 Hon San Technology  CO.,LTD. 

    This website uses cookies.

    We use cookies to analyze website traffic and optimize your experience on the website. By accepting our use of cookies, your data will be combined with other users' data. 

    RefuseAccept