MODEL NO. HS01MWCP-SE/Thermocouple embedded cold plate
Description：
The HS01MWCP-SE, developed by Hon San Technology CO., LTD., is a high-efficiency sensor-based liquid-cooled module designed for precision thermal management applications. This advanced cold plate integrates built-in sensors that extend 1mm above the cooling surface, enabling precise, real-time temperature monitoring directly at the heat conduction interface. Engineered for high-performance cooling and precise thermal control, it is particularly suited for industrial and high-tech environments. Below is a detailed overview of its structure and features:
Technical Specifications：
- Dimensions: 420mm x 38.7mm x 26.5mm
- Weight: 1.1kg
- Safe liquid flow rate: 10L/min
- Maximum liquid flow rate: 13L/min
- Maximum liquid pressure: 0.57kg/cm²
- Heat dissipation area: 16,254mm²
- Applicable tubing diameter: 1/2″ hose
Cooling Performance：
- Thermal resistance (reference): Approximately 0.0108℃/W at 20°C cooling liquid temperature with a standard flow rate of 10L/min
- Cooling effect for a 2000W heat source (reference): Heat conduction surface temperature is approximately 46°C
Material and Structure：
- Material: High thermal conductivity aluminum alloy for efficient heat dissipation
- Temperature sensing points: Built-in six retractable K-type temperature sensors for precise heat monitoring
Performance and Compatibility：
- Real-time temperature monitoring: Provides instant feedback on temperature changes, ensuring optimal cooling performance
- Compatibility: Designed to pair with Hon San Technology CO.,LTD. chilled water circulation systems or air-water heat exchangers for precise temperature control
Applications：
- Mechanical Equipment Cooling: Suitable for high-performance mechanical equipment cooling.
- Electronic Components Cooling: Ideal for maintaining optimal operating temperatures of sensitive electronic parts.
- Semiconductor Cooling: Effective for thermal management in semiconductor manufacturing and testing environments.
Additional Features：
- Customizable Mounting: The cooling plate can be customization for mounting holes to fit specific heat sources as per client requirements.
- Durability: Built to withstand high-pressure conditions and maintain performance over extended periods.
Others：
- The HS01MWCP-SE from Hon San Technology is a high-performance sensor-integrated liquid cooling plate designed for advanced thermal management applications. The design of this liquid cooling plate for applications that demand high-efficiency cooling and precise temperature monitoring, making it an excellent choice for industrial and high-tech environments.