MODEL No. HS03SWCP-e /Liquid cold plate
Description
- The HS03SWCP-e cold plate is designed with an integrated liquid path to ensure efficient cooling. Its dimensions are 150mm x 45mm x 34mm, and it has a weight of 0.54kg. It operates optimally at a flow rate of 10L/min or less, though it can handle up to 14L/min, and withstands a maximum pressure of 1kg/cm^2. The heat transfer area provided is 6750mm^2. Its vertical heat transfer path is ideally suited for heat sources located below. When coolant is introduced, it rapidly cools the hot component, which helps to maintain its lifespan. To achieve real-time temperature stability throughout the system, integrating our chiller or an air-cooled liquid heat exchanger is recommended. Additionally, the coolant inlet/outlet joints are designed for compatibility with 1/2" ID hoses, and the high thermal conductivity of the aluminum body minimizes surface temperature variations.
Dimensions and Weight:
- The HS03SWCP-e measures 150mm x 45mm x 34mm, making it compact and suitable for various applications.
- It weighs approximately 0.54kg, ensuring ease of integration into cooling systems.
Coolant Compatibility and Flow Rates:
- The inlet and outlet connectors of this water cooling plate are compatible with 1/2" soft hoses.
- It can handle a safe flow rate of up to 10L/min and a maximum flow rate of 14L/min.
- The maximum water pressure it can withstand is 1kg/cm².
Heat Dissipation Design:
- The HS03SWCP-e is vertically oriented, making it suitable for point heat source configurations (such as placing it below a CPU or other components).
- Once coolant is introduced, it rapidly reduces the temperature of connected components.
Special Features:
- Low Thermal Resistance: The design minimizes heat resistance between the heat source and the cooling plate.
- Uniform Heat Conduction: Ensures even heat distribution across the plate.
- Ideal for Heat Sources Below 2000W: It’s particularly effective for cooling components with power levels up to 2000W, providing either temperature reduction or precise temperature control using liquid cooling modules.