Hon San Technology CO.,LTD.
Hon San Technology CO.,LTD.
  • HOME
  • ABOUT US
  • PRODUCTS
  • LANGUAGE
    • Traditional Chinese
  • More
    • HOME
    • ABOUT US
    • PRODUCTS
    • LANGUAGE
      • Traditional Chinese
  • HOME
  • ABOUT US
  • PRODUCTS
  • LANGUAGE
    • Traditional Chinese

MODEL No. HS04SWCP / Liquid cold plate

HS04SWCP is flat design ensures even heat distribution across the entire surface.

Description:

The HS04SWCP is a liquid-cooled module equipped with an effective internal liquid flow system designed to cool heat sources. It measures 150mm x 45mm x 26.5mm, weighs 0.4kg, and operate safely with a water flow rate of 10L/min or below. Its thermal resistance is approximately 0.0165℃/W (reference). Featuring a heat dissipation surface area of 6750mm², its flat design is suitable for use in narrow and elongated spaces.

Technical Specifications:

  • Dimensions: 150mm x 45mm x 26.5mm, ideal for narrow and confined spaces
  • ·Weight: 0.4kg
  • Material: High thermal conductivity aluminum alloy for superior heat dissipation
  • Safe liquid flow rate: 10L/min or below
  • Maximum liquid flow rate: 14L/min for efficient cooling
  • Maximum liquid pressure: 1kg/cm² to ensure operational safety

Cooling Performance:

  • Thermal resistance (reference): Approximately 0.0165℃/W at 20°C cooling liquid temperature with a standard flow rate of 10L/min
  • Cooling effect for 2000W heat source: Heat conduction surface temperature is approximately 58°C. 

Design Features:

  • Cooling liquid inlet/outlet connectors: Compatible with 1/2″ hoses for convenient connection
  • Heat dissipation area: Approximately 6750mm² for efficient thermal management

Structure:

Heat source mounting holes: Customizable based on client requirements for securing heat sources

CHARACTERS & FEATURES

HS04SWCP Flowrate vs. Thermal Resistance

    Copyright © 2024 Hon San Technology  CO.,LTD. 

    This website uses cookies.

    We use cookies to analyze website traffic and optimize your experience on the website. By accepting our use of cookies, your data will be combined with other users' data. 

    RefuseAccept