Hon San Technology CO.,LTD.
Hon San Technology CO.,LTD.
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MODEL NO. HS05MWCP / Liquid cold plate

HS05MWCP cold plate's flat design and a conductive area of 160,000mm^2 are perfect for cooling.

Description:

The HS05MWCP is a liquid-cooled module designed for efficient cooling of heat sources. With dimensions of 400mm x 400mm x 30mm and a safe liquid flow rate of 10L/min or below, it provides remarkable cooling performance. Its thermal resistance is approximately 0.00232℃/W (reference), and it offers an expansive heat dissipation area of 160,000mm², making it ideal for planar heat source cooling. 

Technical Specifications:

  • Dimensions: 400mm x 400mm x 30mm
  • Weight: 3.6kg
  • Material: High thermal conductivity aluminum alloy for superior heat dissipation
  • Safe liquid flow rate: 10L/min or below
  • Maximum liquid flow rate: 12L/min for efficient cooling
  • Maximum liquid pressure: 0.67kg/cm², ensuring safe operation

Cooling Performance:

  • Thermal resistance (reference): Approximately 0.00232℃/W at 20°C cooling liquid temperature with a standard flow rate of 10L/min
  • Cooling effect for a 2000W heat source: Reference temperature on the heat conduction surface is approximately 27°C

Design Features:

  • Cooling liquid inlet/outlet fittings: Compatible with 1/2″ hoses for convenient connection
  • Heat dissipation area: Extensive surface area of 160,000mm² for effective cooling
  • Flat design: Optimized for planar heat source cooling, suitable for narrow spaces

CHARACTERS & FEATURES

HS05MWCP Flowrate vs. Thermal Resistance

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