MODEL No.HS06SWCP-SE/Thermocouple embedded cold plate

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The HS06SWCP-SE cold plate features an integrated liquid pathway for efficient cooling and includes nine sets of TYPE K sensors. Its dimensions are 200mm x 200mm x 40.5mm. We recommend a flow rate of less than 5L/min and a pressure of less than 0.5kg/cm^2. The heat conductive area is 40,000mm^2. With nine temperature detection points spread across the heat conduction surface, we recommend using our chiller or air-cooled heat exchanger to maintain a stable temperature throughout the system in real time.

• Dimensions: 200mm x 200mm x 40.5mm
• Weight: 3kg
• Safe Flow Rate: Up to 5L/min
• Maximum Flow Rate: 11L/min
• Maximum liquid Pressure: 1.2kg/cm²
• Cooling Area: 40000mm²
• Compatible Hose Diameter: 1/2" soft hose

• Material: Constructed from high thermal conductivity aluminum alloy, ensuring efficient heat dissipation.
• Temperature Sensors: Equipped with 9 temperature sensing points distributed across the heat-conducting surface for precise thermal monitoring.
• Built-in Sensor: Integrated TYPE K thermocouple for accurate temperature readings.

• Real-time Temperature Monitoring: Provides immediate feedback on temperature changes, ensuring best cooling performance.
• Compatibility: Designed to work seamlessly with Hon San Technology’s chiller systems or air-cooled heat exchanger, enabling precise temperature control.

• Mechanical Equipment Cooling: Suitable for cooling requirements with thermal ratings between 200W and 800W.
• Electronic Components Cooling: Ideal for supporting best operating temperatures of sensitive electronic parts.
• Semiconductor Cooling: Effective for thermal management in semiconductor manufacturing and testing environments.

• Customizable Mounting: The cooling plate can be customized with mounting holes to fit specific heat sources as per client requirements.
• Durability: Built to withstand high-pressure conditions and support performance over extended periods.

The HS06SWCP-SE from Hon San Technology is a high-performance sensor-integrated liquid cooling plate designed for advanced thermal management applications. This liquid cooling plate is engineered for applications that demand high-efficiency cooling and precise temperature monitoring, making it an excellent choice for industrial and high-tech environments.