MODEL No. HS07SWCP-SE/Thermocouple embedded cold plate
Description:
The HS07SWCP-SE cold plate features an integrated liquid pathway for efficient cooling and includes three TYPE K sensors. Its dimensions are 180mm x 25mm x 40.5mm. We recommend a flow rate of less than 7L/min and a pressure of less than 0.67kg/cm². The heat conductive area is 4500mm². With three temperature detection points on the heat conduction surface, we recommend using our chiller or air-cooled heat exchanger to support a consistent temperature throughout the system in real time.
Technical Specifications：
- Dimensions: 180mm x 25mm x 40.5mm
- Weight: 0.4kg
- Safe liquid Flow Rate: Up to 7L/min
- Maximum liquid Pressure: 0.67kg/cm²
- Cooling Area: 4500mm²
- Compatible Hose Diameter: 1/2" soft hose
Material and Construction:
- Material: Constructed from high thermal conductivity aluminum alloy, ensuring efficient heat dissipation.
- Temperature Sensors: Equipped with 3 temperature sensing points distributed across the heat-conducting surface for precise thermal monitoring.
- Built-in Sensor: Integrated TYPE K thermocouple for accurate temperature readings.
Cooling Performance：
- Thermal resistance (reference): Approximately 0.0087℃/W at 20°C cooling liquid temperature with a standard flow rate of 7L/min
- Cooling effect for a 500W heat source (reference): Heat conduction surface temperature is approximately 26.8°C
Applications:
- Mechanical Equipment Cooling: Suitable for cooling systems with thermal ratings up to 200W.
- Electronic Components Cooling: Ideal for supporting optimal operating temperatures of sensitive electronic parts.
- Semiconductor Cooling: Effective for thermal management in semiconductor manufacturing and testing environments.
Additional Features：
- Customizable Mounting: The cooling plate can be customized with mounting holes to fit specific heat sources as per client requirements.
- Durability: Built to withstand high-pressure conditions and support performance over extended periods.