MODEL No. HS08SWCP / Liquid cold plate

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The HS08SWCP is a liquid-cooled module with an efficient internal water flow system for cooling heat sources. It measures 58mm x50mm x 26.5mm, weighs 0.kg, and operates safely at a flow rate of 10L/min. Its thermal resistance approximately 0.0269℃/W (reference), and it has a heat dissipation surface area of 2900mm². Additionally, the HS08SWCP can be connected in series with the HS09SWCP to expand the cooling area.

• Dimensions: 58mm x 50mm x 26.5mm, compact size
• Weight: 0.175kg
• Material: High thermal conductivity aluminum alloy for superior heat dissipation
• Safe liquid flow rate: 10L/min or below
• Maximum liquid flow rate: 16L/min for enhanced cooling efficiency
• Maximum liquid pressure: 0.58kg/cm², ensuring operational safety

• Thermal resistance (reference): Approximately 0.0269℃/W at 20°C cooling liquid temperature with a standard flow rate of 10L/min
• Cooling effect for a 2000W heat source: Heat conduction surface temperature is approximately 36.7°C

• Cooling liquid inlet/outlet connectors: Compatible with 1/2″ hoses for convenient setup
• Heat dissipation area: Around 2900mm², offering outstanding cooling performance despite the compact size
• Cooling structure: Can be connected in series with the HS09SWCP to form a linear liquid-cooling module, extending the cooling range

• Heat source mounting holes: Customizable based on client requirements for securely fixing the heat source