Hon San Technology CO.,LTD.
Hon San Technology CO.,LTD.
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MODEL No. HS20SWCP / Liquid cold plate

The HS20SWCP liquid cold plate is capable of managing heat loads ranging from 50W to 200W.

Description :

The HS20SWCP is a liquid-cooled plate for a clamping mechanism to interface with heat sources. Its are 58 x 50mm x19.5mm, with a of approximately 0.135kg. It operates safely at a liquid flow rate of 5L/min or below and has a thermal resistance of approximately 0.049℃/W (reference). The cooling design focuses heat dissipation at the center, optimizing the flow field to enhance cooling efficiency. It is particularly well-suited for point heat sources.

Technical Specifications :

  • Dimensions: 58mm x 50mm x 19.5mm
  • Weight: 0.135kg
  • Material: High thermal conductivity aluminum alloy for superior heat dissipation
  • Safe liquid flow rate: 5L/min or below for stable long-term operation
  • Maximum liquid flow rate: 10L/min for efficient cooling performance
  • Maximum liquid pressure: 0.27kg/cm² to ensure operational safety

Cooling Performance:

  • Thermal resistance (reference): Approximately 0.049℃/W at 20°C cooling liquid temperature with a standard flow rate of 5L/min
  • Cooling effect for a 500W heat source: Heat conduction surface temperature is approximately 49°C

Design Features:

  • Flat design: Ideal for clamping mechanisms, simplifying installation and maintenance
  • Cooling liquid inlet/outlet connectors: Compatible with 1/2″ hoses for convenient setup
  • Heat dissipation area: Focused on the center point to maximize cooling efficiency

CHARACTERS & FEATURES

HS20SWCP Flowrate vs. Thermal Resistance

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