The HS20SWCP is a compact liquid cold plate designed for efficient heat dissipation. It specifically crafted for point heat source cooling, making it ideal for applications like electronic components, semiconductor devices, and mechanical cooling systems.
Here are the key specifications:
Dimensions: 58mm x 50mm x 19.5mm
Weight: 0.135 kg
Safe flow rate: Up to five liters per minute
Maximum flow rate: ten liters per minute
Maximum water pressure: 0.7 kg/cm²
Heat dissipation area: Concentrated at the center.
Compatible with 1/2" soft hoses
Requires additional clamping mechanism for securing the heat source.
The HS20SWCP is thin, lightweight, and efficient, allowing for rapid cooling once coolant entered. It pairs seamlessly with Hon San’s cooling liquid circulation system for precise temperature control.
Applications:
The HS20SWCP is well-suited for various scenarios:
Mechanical Cooling: It can manage heat loads ranging from 50W to 200W, making it suitable for mechanical cooling applications.
Electronics Cooling: Use it to cool electronic components effectively.
Semiconductor Cooling: When you need reliable cooling for semiconductor devices, the HS20SWCP fits the bill.
Additional Products:
If you are interested in related cooling solutions, consider these:
RC6311: A 7-liter temperature-controlled cooling liquid circulation machine.
RC63113F: An intelligent temperature-controlled cooling liquid machine with adjustable flow rates.
HS6333: A 30-liter temperature-controlled cooling liquid circulation machine.
HS1001: A 4.5-liter liquid heat exchanger transferring heat from liquid to air, effectively reducing the overall temperature.
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