MODEL NO. HS34SWCP-SE /Thermocouple embedded cold plate
Description
- The HS34SWCP-SE has dimensions of 160mm x 100mm x 29mm and includes one set of embedded K TYPE thermocouple sensors. The thermal resistance is approximately 0.00121426 ℃/W, assuming a cooling water flow rate of 10L/min at a room temperature of 20°C.
Technical Specifications
- Dimensions: 160mm x 100mm x 29mm
- Weight: 1kg
- Safe Water Flow Rate: 10L/min
- Maximum Water Flow Rate: 15L/min
- Maximum Water Pressure: 0.85kg/cm²
- Cooling Area: 16000mm²
- Compatible Hose Diameter: 1/2" soft hose
Material and Construction
- Material: Constructed from high thermal conductivity aluminum alloy, ensuring efficient heat dissipation.
- Temperature Sensors: Equipped with a retractable K-type thermocouple for precise thermal monitoring.
- Thermal Resistance: Approximately 0.00121426 ℃/W at a flow rate of 10L/min and ambient temperature of 20℃.
Performance and Compatibility
- Real-time Temperature Monitoring: Provides immediate feedback on temperature changes, ensuring optimal cooling performance.
- Compatibility: Designed to work seamlessly with Hon San Technology’s chiller systems or air-cooled heat exchanger, enabling precise temperature control.
Applications
- Mechanical Equipment Cooling: Suitable for high-performance mechanical equipment cooling.
- Electronic Components Cooling: Ideal for maintaining optimal operating temperatures of sensitive electronic parts.
- Semiconductor Cooling: Effective for thermal management in semiconductor manufacturing and testing environments.
Additional Features
- Customizable Mounting: The cooling plate can be customization for mounting holes to fit specific heat sources as per client requirements.
- Durability: Built to withstand high-pressure conditions and maintain performance over extended periods.
Others
- The HS34SWCP-SE from Hon San Technology is a high-performance sensor-integrated liquid cooling plate designed for advanced thermal management applications. It is a high-performance liquid cooling plate designed for applications requiring efficient cooling and accurate temperature control, ideal for use in industrial and advanced technology settings.