MODEL NO. HS34SWCP-SE /Thermocouple embedded cold plate

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The HS34SWCP-SE, developed by Hon San Technology, is a high-efficiency sensor built in liquid-cooled module specifically designed for precise thermal management applications. This advanced cold plate features customized tube fittings tailored to meet specific operational requirements, ensuring seamless integration in specialized setups. Below is a detailed introduction:

• Dimensions: 160mm x 100mm x 29mm
• Weight: 1kg
• Safe liquid flow rate: 10L/min
• Maximum liquid flow rate: 15L/min
• Maximum liquid pressure: 0.85kg/cm²
• Heat dissipation area: 16,000mm²
• Applicable tubing fitting: Customized G1/2″ pipe threads

• Material: High thermal conductivity aluminum alloy for efficient heat dissipation
• Temperature sensing point: Integrated retractable K-type temperature sensor for accurate heat monitoring

• Thermal resistance (reference): Approximately 0.00121℃/W at 20°C cooling liquid temperature with a standard flow rate of 10L/min
• Cooling effect for a 2000W heat source (reference): Heat conduction surface temperature is approximately 25°C

• Mechanical Equipment Cooling: Suitable for high-performance mechanical equipment cooling.
• Electronic Components Cooling: Ideal for maintaining optimal operating temperatures of sensitive electronic parts.
• Semiconductor Cooling: Effective for thermal management in semiconductor manufacturing and testing environments.

• Customizable installation: Mounting holes can be tailored to specific customer requirements to accommodate unique heat sources
• Durability: Engineered to withstand high-pressure conditions while maintaining long-term performance

The HS34SWCP-SE from Hon San Technology is a high-performance sensor-integrated liquid cooling plate designed for advanced thermal management applications.  It is a high-performance liquid cooling plate designed for applications requiring efficient cooling and accurate temperature control, ideal for use in industrial and advanced technology settings.